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HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD
HENAN ZG INDUSTRIAL PRODUCTS CO.,LTD
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High precision silicon carbide components for semiconductor processes and optical machinery equipment

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High precision silicon carbide components for semiconductor processes and optical machinery equipment

Brand Name : ZG

Model Number : MS

Certification : CE

Place of Origin : CHINA

MOQ : 1 piece

Price : USD10/piece

Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram

Supply Ability : 10000 pieces per month

Delivery Time : 3 working days

Packaging Details : Strong wooden box for Global shipping

Application : fine chemical industry, pharmaceutical industry, environmental protection engineering

Dimension : the maximum diameter of tube bundle block can reach 200mm, and the height can be 500mm.

Material : Silicon carbide

Color : Black

Product name : silicon carbide tube bundle block

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High precision silicon carbide components for

semiconductor processes and optical machinery equipment

Silicon carbide robotic arm is formed by isostatic pressing process and sintering at high temperature. According to the requirements of the user's design drawings, the size, thickness and shape can be finished to meet the specific requirements of the user.

Typical applications
  • Used for wafer transmission in various semiconductor manufacturing processes.
Features and advantages
  • Accurate size and thermal stability
  • High specific stiffness and excellent thermal uniformity, long-term use is not easy to bend deformation;
  • The wafer has a smooth surface and good wear resistance, allowing safe handling of the wafer without particle contamination.
  • Coresic ® SP resistivity silicon carbide in 106-108 Ω, nonmagnetic, accord with the normative requirement of ESD resistance; It prevents static electricity from accumulating on the surface of the wafer.
  • Good thermal conductivity, low coefficient of expansion.
Specifications
  • According to customer's drawings, we can process different shapes and sizes of arms.

High precision silicon carbide components for semiconductor processes and optical machinery equipment

Silicon carbide vacuum chuck is formed by isostatic pressing process and sintering at high temperature. According to the requirements of the user's design drawings, the size, thickness and shape can be finished to meet the specific requirements of the user.

Typical applications

  • In semiconductor manufacturing, extremely thin wafers are placed on silicon carbide vacuum suckers, connected to a vacuum generator, and the wafers are fixed by vacuum suction.

  • Used in lithography, etching, laser processing, wafer testing and other processes.

Features and advantages

  • Accurate size and thermal stability

  • Good thermal conductivity, low coefficient of expansion and temperature uniformity

  • Extremely high wear resistance and surface finish, fine pore size and uniform distribution, can be uniformly adsorbed to all areas of the wafer

  • Excellent acid and alkali corrosion resistance

  • Plasma impact resistance

Specifications

  • Can be customized according to customer drawings processing.

High precision silicon carbide components for semiconductor processes and optical machinery equipment


Product Tags:

nonmagnetic silicon carbide components

      

Nonmagnetic Industrial Ceramic Parts

      

High Temperature Sintering Silicon Carbide

      
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